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CoolSiC MOSFET 技术通过最大限度地发挥碳化硅强大的物理特性,从而增强了设备性能、稳健性和易用性等独特优势。 IMZA65R107M1H 650V CoolSiC™ MOSFET 基于先进的沟槽半导体技术,并经过优化,在毫不折衷的情况下,在应用中实现最低损耗,并在运行中实现最佳可靠性。

英飞凌 SiC MOSFET 采用 TO247 4 引脚封装,可降低源极寄生电感对门极电路的影响,从而加快开关速度,提高效率。

  • Understand package inductance
  • Know why wide bandgap transistors are more susceptible to package inductance, and
  • Identify which Infineon package types have lower inductance
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    Introduction to Infineon 650V CoolSiC™ MOSFET

    Infineon 650V CoolSiC™ MOSFETs offer a perfect response to the progressing mega trends: more efficiency and power density.

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    650 V CoolSiC™ MOSFET - Technology comparison (Module 1)

    650 V CoolSiC™ technology parameters in a straight comparison with the 600 V CoolMOS™ CFD7.

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    Get familiar with the main target topologies and the benefits 650 V CoolSiC™ has to offer.

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    650 V CoolSiC™ MOSFET – Design guidelines (Module 3)

    Understand critical design information in order to get the best out of the 650 V CoolSiC™.

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    Bi-directional converters using WBG

    Understand why to use WBG switches for bi-directional converters, the topologies used and how they function.

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